Manufacturing method of color Micro LED display chip module

• Main Authors: WU YONGSHENG, QI JIAPENG, ZHANG FAN
• Format: Patent
• Language: Chinese; English
• Published: 27.05.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a manufacturing method of a color Micro LED display chip module, which comprises the following steps of: preparing a Micro LED chip on a substrate, grinding and cutting the chip, welding the chip on a driving substrate in an inverted manner, and stripping the chip from the substrate, so that compared with the prior art that the whole surface of a chip wafer is stripped, the stripping difficulty is small, and the yield is high. The quantum dot hole sites corresponding to the positions of the sub-pixel units of the chip are manufactured on the transparent substrate, the quantum dot hole sites are filled with the quantum dot light color conversion substances, and the quantum dot protection layer is deposited, so that the conversion device is independently manufactured on the transparent substrate; after the full-color quantum dot conversion device is inverted, the full-color quantum dot conversion device is aligned and bonded with the integrated single-color Micro LED module substrate, an