Embedded injection molding method for gluing high-temperature terminal
The invention discloses an embedding injection molding method for a glued high-temperature terminal. The embedding injection molding method comprises the following steps: obtaining a glued hardware terminal; the glued hardware terminal is placed in a baking oven, the temperature is set to be 100-120...
Saved in:
Main Author | |
---|---|
Format | Patent |
Language | Chinese English |
Published |
24.05.2022
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention discloses an embedding injection molding method for a glued high-temperature terminal. The embedding injection molding method comprises the following steps: obtaining a glued hardware terminal; the glued hardware terminal is placed in a baking oven, the temperature is set to be 100-120 DEG C, and the baking time is set to be 2H-4H; transferring the baked glued hardware terminal in a box, and pre-inserting the baked glued hardware terminal into a jig after the baked glued hardware terminal is in place; and embedding the jig into which the baked glued hardware terminal is pre-inserted into the mold, and carrying out injection molding. According to the method, the glued hardware terminal and the plastic material are subjected to injection molding after the glued hardware terminal is kept at a hot temperature, plastic bonding and integrated forming are easier, meanwhile, the hardware terminal piece is more tightly sealed, and the injection molded piece is firmer, more attached, low in energy consump |
---|---|
Bibliography: | Application Number: CN202111639823 |