Embedded injection molding method for gluing high-temperature terminal

• Main Author: PENG WENGUANG
• Format: Patent
• Language: Chinese; English
• Published: 24.05.2022
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention discloses an embedding injection molding method for a glued high-temperature terminal. The embedding injection molding method comprises the following steps: obtaining a glued hardware terminal; the glued hardware terminal is placed in a baking oven, the temperature is set to be 100-120 DEG C, and the baking time is set to be 2H-4H; transferring the baked glued hardware terminal in a box, and pre-inserting the baked glued hardware terminal into a jig after the baked glued hardware terminal is in place; and embedding the jig into which the baked glued hardware terminal is pre-inserted into the mold, and carrying out injection molding. According to the method, the glued hardware terminal and the plastic material are subjected to injection molding after the glued hardware terminal is kept at a hot temperature, plastic bonding and integrated forming are easier, meanwhile, the hardware terminal piece is more tightly sealed, and the injection molded piece is firmer, more attached, low in energy consump