Laser column planting method for CCGA high-lead welding column

• Main Authors: ZOU JIAJIA, YANG ZHAOJUN, ZHAO DAN, LI MIAO, CHENG WENHUA, LI LEI
• Format: Patent
• Language: Chinese; English
• Published: 20.05.2022
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention relates to the technical field of radar electronic functional component manufacturing, in particular to a laser column implanting method for a CCGA high-lead welding column, which comprises the following steps of: removing an original CCGA high-lead welding column, printing a welding paste on a CCGA ceramic substrate bonding pad, picking up the high-lead welding column, placing the high-lead welding column on a corresponding bonding pad, completing column implanting and laser welding, and forming a good welding spot between the high-lead welding column and a ceramic substrate. The CCGA prepared by the column implanting process has more than 1000 high-lead welding columns, the welding time is less than or equal to 10 minutes, the coplanarity of the whole device is less than or equal to 0.15 mm, the skew of the whole welding columns of the device is less than or equal to 5 degrees, the skew of a peripheral single welding column is less than or equal to 5 degrees, the welding precision is less than