Electronic equipment and preparation method thereof

The technical scheme of the invention discloses electronic equipment and a preparation method thereof, and the electronic equipment comprises a circuit board which is fixedly arranged in a housing of the electronic equipment; the heating element is fixedly arranged on the circuit board and electrica...

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Bibliographic Details
Main Authors ZHEN QINGJUAN, CHU ZHONGLIANG
Format Patent
LanguageChinese
English
Published 13.05.2022
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The technical scheme of the invention discloses electronic equipment and a preparation method thereof, and the electronic equipment comprises a circuit board which is fixedly arranged in a housing of the electronic equipment; the heating element is fixedly arranged on the circuit board and electrically connected with the circuit board, and the heating element generates heat in a working state; the heat dissipation assembly is fixedly connected with the heating element, and the heat dissipation assembly makes contact with the heating element and is used for conducting heat exchange with a fluid medium; the liquid metal is positioned between the microstructures of the contact surfaces of the heating elements and between the microstructures of the contact surfaces of the heat dissipation assembly and is used for reducing the thermal resistance between the heat dissipation assembly and the heating elements; and the sealing element surrounds the periphery of the heating element and is used for sealing the liquid m
Bibliography:Application Number: CN202210277531