Random multi-area efficient polishing path planning method oriented to matching working conditions

The invention discloses a random multi-region efficient polishing path planning method oriented to a matching working condition, which comprises the following steps: S100, measuring to obtain point cloud data of a matching surface of a soft mold and a hard mold, performing principal component analys...

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Bibliographic Details
Main Authors CHEN WEI, ZHANG XIAOJIAN, WU YI, DING HAN, YAN SIJIE
Format Patent
LanguageChinese
English
Published 13.05.2022
Subjects
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
PHYSICS
REGULATING
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Summary:The invention discloses a random multi-region efficient polishing path planning method oriented to a matching working condition, which comprises the following steps: S100, measuring to obtain point cloud data of a matching surface of a soft mold and a hard mold, performing principal component analysis on the point cloud data to correct, fitting the surface of the point cloud data of a stiffened wall plate, taking a complementary set, matching with the point cloud data of a sacrificial layer, and obtaining the point cloud data of the stiffened wall plate; taking a difference value in the height direction to obtain a to-be-processed height map of the surface of the sacrificial layer; s200, the maximum height and the minimum height of the height map to be machined are extracted, and the machining sequence and the single-time machining depth are planned according to the maximum height difference, the grinding head removal depth model and the workpiece surface matching precision requirement; s300, the processing s
Bibliography:Application Number: CN202210016548