Polyamide-imide film and preparation method thereof

• Main Authors: LIM DONG-JIN, OH DAE-SEONG, KIM SUN-HWAN, JEONG DA-WOO, LEE JIN-WOO
• Format: Patent
• Language: Chinese; English
• Published: 10.05.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

Embodiments relate to a polyamide-imide film having excellent tensile toughness and elastic restoring force and a method for preparing the same, the polyamide-imide film comprising a polyamide-imide polymer formed by polymerizing a diamine compound, a dianhydride compound, and a dicarbonyl compound, in a stress-strain curve of the polyamide-imide film measured using a universal tester, the area value to the yield point as derived by a 0.2% offset method is 80-150 J/m2. 实施方案涉及一种具有优异的拉伸韧性和弹性恢复力的聚酰胺-酰亚胺薄膜及其制备方法，所述聚酰胺-酰亚胺薄膜包含通过聚合二胺化合物、二酐化合物和二羰基化合物形成的聚酰胺-酰亚胺聚合物，在使用万能试验机测量的所述聚酰胺-酰亚胺薄膜的应力-应变曲线中，通过0.2％偏移法导出的到屈服点为止的面积值为80至150J/m2。