Preparation and disassembly of dynamic covalent and non-covalent bond parallel interlocking polymer

• Main Authors: ZHOU LINFANG, ZHOU LIN, CHANG GUANJUN, CHEN MAO
• Format: Patent
• Language: Chinese; English
• Published: 10.05.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The invention provides a double-dynamic-bond parallel interlocking cross-linked selectively-disassembled epoxy polymer based on dynamic covalent bonds and dynamic non-covalent bonds. Complete curing of 50-100 parts by weight of epoxy resin, two different proportions of epoxy curing agents with the total amount of 20-80 parts and ionic salts in a certain proportion with ligand units in the curing agents forming dynamic non-covalent bonds (generally the concentration of metal ions is 1/80-1 of the ligand units) at high temperature to obtain parallel interlocking crosslinking based on double dynamic bonds and the epoxy polymer can be selectively disassembled. The double-dynamic-bond parallel interlocking cross-linked epoxy polymer based on the dynamic covalent bond and the dynamic non-covalent bond has good stability and selective disassembly performance, that is, disassembly of the double-dynamic-bond parallel interlocking cross-linked epoxy polymer cannot be achieved through single stimulation, and disassembly