Component supply device and cover tape peeling method

• Main Authors: LI QIANGLI, ISOBATA YOSHINORI, YAMAMURA TATSUO
• Format: Patent
• Language: Chinese; English
• Published: 06.05.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONVEYING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PACKING; PERFORMING OPERATIONS; PRINTED CIRCUITS; STORING; TRANSPORTING; UNPACKING

A component supply device that supplies a component accommodated in a carrier tape that includes a base tape and a cover tape that is adhered to the base tape and that is longer than the base tape up to a leading end, the component supply device being provided with: a transport unit that transports the carrier tape along a transport path; a bend correction unit that moves the tip of the cover tape bent to the opposite side to the conveyance direction in the conveyance path in the conveyance direction relative to the tip of the base tape; and a peeling part which captures the front end of the cover tape and peels the cover tape from the base tape. 一种部件供给装置，其供给载带所收纳的部件，该载带包括基带和粘贴于基带且到前端为止比基带长的盖带，且具备：输送部，其沿输送路输送载带；弯折矫正部，其在输送路内使向与输送方向相反的一侧弯折的盖带的前端相比基带的前端向输送方向移动；以及剥离部，其捕捉盖带的前端并将盖带从基带剥离。