Photo-curing anti-powder-falling PVDF (Polyvinylidene Fluoride) gluing diaphragm and preparation process thereof

• Main Authors: ZHANG LIBIN, WANG LIN, SHEN YADING
• Format: Patent
• Language: Chinese; English
• Published: 06.05.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRICITY; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY

The invention belongs to the technical field of glued diaphragms, and particularly relates to a photocuring and anti-powder-falling PVDF glued diaphragm and a preparation process thereof, the photocuring and anti-powder-falling PVDF glued diaphragm comprises a base film and a PVDF glue layer coated on the surface of the base film; the PVDF adhesive layer comprises PVDF powder and a light curing adhesive; the PVDF powder is fixed on the base film through light curing after the PVDF powder is fixed by the light curing adhesive through drying and crosslinking; compared with an existing water-based PVDF gluing technology, the PVDF gluing diaphragm with the photocuring and powder falling prevention functions and the preparation technology of the PVDF gluing diaphragm have the advantages that the prepared PVDF gluing diaphragm is high in gluing layer peeling strength and pole piece bonding performance. Meanwhile, the comprehensive performance of the PVDF glued diaphragm can be regulated and controlled by adjusting