High-temperature-resistant bismaleimide-polyimide interpenetrating structure foam material and preparation method thereof

• Main Authors: ZHOU GUANGYUAN, CHEN CUNYOU, NIE HERAN
• Format: Patent
• Language: Chinese; English
• Published: 06.05.2022
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The invention provides a bismaleimide-polyimide foam material. The foam material is provided with an interpenetrating structure of bismaleimide and polyimide. According to the high-temperature-resistant bismaleimide-polyimide interpenetrating structure foam with the specific structure, a long-chain polyimide molecular chain is introduced into a bismaleimide cross-linking system in an interpenetrating network mode, and the cross-linked bismaleimide molecular chain can limit movement of the polyimide long molecular chain; meanwhile, the expanded polyimide long molecular chain can release stress more quickly, the toughness of the foam material is improved, the mechanical property and the temperature resistance brought by high cross-linking curing of the foam bismaleimide can be endowed, and the toughness brought by the foam imide long chain can also be endowed. The bismaleimide-polyimide interpenetrating structure foam prepared by the preparation method disclosed by the invention has the advantages that the temp