Wafer alignment method and device and semiconductor device

• Main Authors: HE XIAOBIN, LIU JINBIAO, NAM TAE-HO, YANG TAO, LIANG SHIYUAN, LI TINGTING
• Format: Patent
• Language: Chinese; English
• Published: 22.04.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

The invention discloses a wafer alignment method and device and a semiconductor device, and the method comprises the steps: collecting the flatness data of a whole wafer, obtaining the flatness data in an exposure field at a preset position, and enabling the exposure field at the preset position to comprise an alignment mark for wafer alignment; judging whether the flatness data in the exposure field at the preset position meets a preset condition or not; if the flatness data does not conform to the preset condition, selecting the exposure field with the flatness data conforming to the preset condition from other exposure fields on the wafer, and performing wafer alignment by using the alignment mark contained in the selected exposure field, so as to avoid the problem of alignment failure caused by local focal length abnormality of the wafer flatness map; therefore, the purpose of reducing the wafer rework rate is achieved, and the production cost is reduced. 本申请公开了一种晶圆对准方法、装置及半导体器件，方法包括：采集整个晶圆的平整度数据，获取位于预设位置