Resin sealing device and resin sealing method

• Main Authors: NISHIZAWA TETSUYA, ITO YUKIO, SUZUKI KAZUHIRO, WAKUI MASAAKI, YANAGISAWA MAKOTO, ANDO SHUJI
• Format: Patent
• Language: Chinese; English
• Published: 22.04.2022
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The invention provides a resin sealing device and a resin sealing method, which can improve the shape retention of liquid resin, granular resin or powder resin supplied by a resin supply part, do not need to worry about the flying of resin powder particles in the conveying process, do not cause pollution in the device, can maintain the cleanliness, and can simplify the structure of the device. The distribution unit (11C) is provided with a resin supply platform (5) on which the workpiece (W) is placed, and a resin distributor (8) for supplying any one of a liquid resin, a granular resin, or a powder resin onto the workpiece (W), and a heater (5a) is built in the resin supply platform (5). The heater (5a) heats and softens the resin (R) supplied onto the workpiece (W) from the resin distributor (8) to a predetermined temperature lower than the molding temperature of the compression molding die (2) in which the upper die cavity is movable. 本发明提供一种树脂密封装置及树脂密封方法，提高由树脂供给部供给的液状树脂、颗粒树脂或粉末树脂的保形性，不用担心在搬送途中树脂粉粒飞舞，不会产生装