Sensing device and manufacturing method thereof

• Main Authors: LI JUNZHENG, YAN DONGFU, LI DANWEI, ZHU MINGJUN, WANG GAOHUI, LEI MEIQIN
• Format: Patent
• Language: Chinese; English
• Published: 19.04.2022
• Subjects: ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR; PHYSICS; PRINTED CIRCUITS; TARIFF METERING APPARATUS; TESTING

The invention provides a sensing device and a manufacturing method thereof, the sensing device comprises a substrate, a red light chip, an infrared light chip and a green light chip, and the red light chip, the infrared light chip and the green light chip are carried on the front surface of the substrate in a delta shape; six back-surface bonding pads are arranged on the back surface of the substrate, the six back-surface bonding pads comprise five electric back-surface bonding pads and an idle back-surface bonding pad, and the idle back-surface bonding pad is not electric; the five electric reverse bonding pads comprise two common reverse bonding pads, the two common reverse bonding pads are connected based on a wire circuit, the front surface of the substrate is provided with six front bonding pads, the six front bonding pads are correspondingly and electrically connected with the six reverse bonding pads, and the three light-emitting chips are arranged on the front surface of the substrate in a delta shape