Thermoelectric module
A thermoelectric module is provided. The thermoelectric module includes a thermoelectric element including a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and...
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| Main Authors | , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
15.04.2022
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| Subjects | |
| Online Access | Get full text |
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| Summary: | A thermoelectric module is provided. The thermoelectric module includes a thermoelectric element including a first substrate, a first electrode disposed on the first substrate, a semiconductor structure disposed on the first electrode, a second electrode disposed on the semiconductor structure, and a second substrate disposed on the second electrode; a heat sink disposed on the second substrate; and an adhesive layer configured to bond the second substrate to the heat sink. The heat sink has a shape in which the predetermined pattern is regularly repeated and connected. Each pattern comprises a first surface opposite to the second substrate and a second surface extending upwards from one end of the first surface; a third surface extending from the second surface and facing the second substrate; and a fourth surface extending upward from the other end of the first surface opposite to the one end and connected to a third surface of an adjacent pattern. A distance between the third surface and the second substra |
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| Bibliography: | Application Number: CN202080062493 |