Preparation method of silicon substrate polished wafer for bonding process

• Main Authors: HAN PING, BIAN YONGZHI, WANG XIN, ZHU XIAOTONG, XU JIPING, LI JUNHONG, LIN LIN, YAN JUNYAO, ZHANG JIANHUA, NING YONGDUO, ZHONG GENGHANG, TIAN FENGGE
• Format: Patent
• Language: Chinese; English
• Published: 15.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

The invention discloses a preparation method of a silicon substrate polished wafer for a bonding process, which comprises the following steps: (1) crystal pulling is carried out by adopting a magnetic field crystal pulling method, the magnetic field type is a horizontal magnetic field, the magnetic...