Cutting device and method

• Main Authors: ARAI YUSUKE, FUKAYA HIRONORI, SHIMIZU TSUBASA, TSUSHIMA TAKEO, TAKEDA KUNIYOSHI
• Format: Patent
• Language: Chinese; English
• Published: 12.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention provides a cutting device and method capable of preventing interference between a cutter and a clamp during cutting and ensuring productivity. The cutting method includes: a shape measurement step of measuring the shape of a workpiece (W); an alignment step in which a measurement result of the shape of the workpiece is acquired, and alignment between the workpiece and the jig is performed on the basis of the acquired measurement result so that a line (CT1) having a width corresponding to the blade thickness of a cutter (32) for cutting the workpiece is housed in a jig groove (G1) of the jig (J1) along a planned dividing line (CL1) of the workpiece; and a step of sucking and holding the workpiece by using the jig and cutting the workpiece along the division predetermined line. 本发明提供一种能够防止切割加工时的刀具与夹具的干涉、并且能够确保生产率的切割装置及方法。切割方法包括：测定工件(W)的形状的形状测定步骤；对准步骤，在该对准步骤中，取得工件的形状的测定结果，并基于所取得的测定结果，以沿着工件的分割预定线(CL1)且与用于进行工件的切割加工的刀具(32)的刃厚对应的宽度的线(CT1)收纳于夹具(J1)的夹具槽(G1)的方式来进行工件与夹具的对准；以及利用夹具吸附保持工件并沿着分割预定线对工件进行切割加工的步骤。