MEMS capacitive six-axis force sensor chip and preparation process thereof

• Main Authors: ZHAO LIBO, CHEN YAO, YANG PING, LI MIN, GAO WENDI, WANG JIUHONG, TAN RENJIE, WANG XIAOZHANG, JIANG ZHUANGDE, DONG LINXI, HAN XIANGGUANG
• Format: Patent
• Language: Chinese; English
• Published: 12.04.2022
• Subjects: MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TESTING; TRANSPORTING

The invention relates to an MEMS capacitive six-axis force sensor chip and a preparation process thereof, the chip comprises a high-resistance silicon device layer, a low-resistance silicon device layer and a glass device layer which are arranged from top to bottom, and a sandwich structure is formed through silicon-silicon bonding and silicon-glass bonding; the high-resistance silicon device layer comprises a first central rigid body and a load transmission structure; the low-resistance silicon device layer comprises a second central rigid body, the periphery of the second central rigid body and the electrode form a comb tooth capacitor, and the second central rigid body is integrally bonded with the first central rigid body on one hand and serves as a common electrode of a comb tooth capacitor moving pole plate on the other hand; the glass device layer comprises a glass substrate, and metal layer structures such as a plate capacitor polar plate, an external bonding pad, an internal bonding pad and a metal l