Moisture and water inflow defect model for cable intermediate joint and preparation method of moisture and water inflow defect model

The embodiment of the invention discloses a cable intermediate joint damp water inflow defect model and a preparation method thereof. The model comprises a cable, an intermediate joint and a connecting pipe, the cable sequentially comprises a copper wire core, a main insulating layer, an outer semi-...

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Main Authors CHENG YANTING, HUANG TAO, CHEN YUN, HUANG YUNMING, HUANG JINGSHI, CHEN QIMIN, ZHANG JIANXIN, LIANG YIWEN, CHEN GUOXIN, CHEN YANWEN, WANG LIGUO, ZHEN WEIYANG, XIAO JIAPENG, YU ZHUOBIN, WANG CHAO, TAN JINGCHAO, FANG ZHEN, WU CHUNFANG, YAN JIAMING, HAO YANPENG, SU YU
Format Patent
LanguageChinese
English
Published 08.04.2022
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Summary:The embodiment of the invention discloses a cable intermediate joint damp water inflow defect model and a preparation method thereof. The model comprises a cable, an intermediate joint and a connecting pipe, the cable sequentially comprises a copper wire core, a main insulating layer, an outer semi-conductive layer and a copper shielding layer from inside to outside. The lengths of the copper wire core, the main insulating layer, the outer semi-conductive layer and the copper shielding layer at one end of the cable are sequentially decreased, so that parts of the copper wire core, the main insulating layer, the outer semi-conductive layer and the copper shielding layer are respectively exposed outside; the number of the cables is two, and the two exposed copper wire cores are connected with each other. The connecting pipe is sleeved on the two copper wire cores; the middle joint is sleeved on the exposed outer semi-conductive layers of the two cables; the gaps between the intermediate joint and the main insul
Bibliography:Application Number: CN202111608666