Processing technology of high-performance photovoltaic module chip

• Main Authors: XU BOCHUN, WU BO, CHEN SONG, ZHANG CAOPENG, FENG YANING, CHO SUN-KEUN
• Format: Patent
• Language: Chinese; English
• Published: 08.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a processing technology of a high-performance photovoltaic module chip, and belongs to the technical field of chips. Step 1, brushing glue; brushing glue on the copper frame material sheet through a screen plate; step 2, wafer expansion: performing wafer expansion on the wafer to obtain crystal grains, and fixing the wafer by using an inner nested wafer expansion ring and an outer nested wafer expansion ring; step 3, die bonding: grabbing crystal grains and placing the crystal grains on the copper frame material sheet brushed with the glue; 4, dispensing: dispensing the middle position of each crystal grain by using soft solder paste; step 5, adding a jumper wire, cutting the jumper wire, and placing the cut jumper wire on the dispensed crystal grain; sixthly, vacuum welding is carried out, and vacuum welding packaging operation is carried out on the packaging body and the copper frame material sheet through a vacuum welding furnace; the problems that an existing bypass diode is low i