Patterned metal layer surface polishing method

• Main Authors: WANG MENGJIA, LI XIAOYU, ZHANG ZHIHONG, GAO CHUNYAN, MAO LIANGHAI, HU YIBIN
• Format: Patent
• Language: Chinese; English
• Published: 05.04.2022
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; POLISHING; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

The invention discloses a method for polishing the surface of a patterned metal layer, which belongs to the technical field of microwave components and comprises the following steps of: spin-coating photosensitive polyimide on the surface of the patterned metal layer on a silicon wafer, and filling and covering the whole Au patterned metal layer; heating and curing the polyimide layer; coating a photoresist layer on the upper surface of the polyimide layer; etching and polishing the photoresist layer, and etching all the photoresist layer to obtain a polyimide layer with a flat surface; continuing to etch the polyimide layer to expose part of the patterned metal layer pattern with relatively high thickness; grinding and polishing the metal layer pattern protruding from the surface until the metal layer pattern is flush with the upper surface of the polyimide; removing the polyimide filled in the gaps of the metal layer patterns; according to the method, the flatness and roughness of the Au microwave circuit p