BONDED BODY OF BONDING SUBSTRATE AND

• Main Authors: MATSUO HIDESHI, HAYASHIDA HIROYUKI, HAYASHIDA HIDENORI, HIROYAMA YUKIHISA
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

Provided is a bonded body of a bonding substrate and a metal layer, the bonding body having a strong adhesion force of the metal layer and a small variation in adhesion force when the metal layer is bonded to the bonding substrate, and being capable of bonding at a low cost. Namely, the present invention is a bonded body of a bonding substrate (1) and a metal layer (5) in which the metal layer (5) is bonded to a bonding substrate (2) via an intermediate layer cover film (2) formed on the bonding surface of the bonding substrate (1), the intermediate layer cover film (2) is welded to the bonding surface of the bonding substrate (1), and anchor formations (3) for bonding the metal layer (5) by an anchoring effect are dispersed and embedded in the intermediate layer cover film (2). A portion of the anchor formation (3) protrudes outward from the intermediate layer cover film (2) and is welded to the intermediate layer cover film (2), and the metal layer (5) is bonded to the surface of the intermediate layer cove