Cooling device with two-level steam chamber

• Main Authors: DHANDAPANI, KASIRAVAN, SHAIKH, JAVED, RAJU PRAKASH KUMAR
• Format: Patent
• Language: Chinese; English
• Published: 29.03.2022
• Subjects: CALCULATING; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; PHYSICS

The invention discloses a cooling device with a two-level steam chamber. In one embodiment, a system includes a chip package and a cooling device coupled with the chip package. The chip package includes one or more processors, and the cooling device includes a first cavity at least partially defined by a first metal wall and a second metal wall and a second cavity at least partially defined by a flat third metal wall and the second metal wall. And the internal pressure of the first cavity is lower than the environment pressure outside the sealed first cavity. The second cavity includes a liquid disposed therein and a core material coupled to an inner surface of the third wall, and the chip package is positioned such that it is coupled to a flat third metal wall of the cooling device. 本申请公开了带有两层级蒸汽腔室的冷却装置。在一个实施例中，一种系统包括芯片封装和与该芯片封装耦合的冷却装置。芯片封装包括一个或多个处理器，并且冷却装置包括至少部分由第一金属壁和第二金属壁界定的第一空腔和至少部分由平坦的第三金属壁和第二金属壁限定的第二空腔。第一空腔的内部压力低于密封的第一空腔外部的环境压力。第二空腔包括设置在其内的液体和与第三壁的内表面耦合的芯子材料，并且芯片封装被定位成使得其耦合到冷却装置的平坦的第三金属壁。