Mold for bending glass sheet comprising heating circuit and cooling circuit

The invention relates to a full mold (3) for bending a glass sheet (1) by pressing, the glass sheet (1) being brought to a deformation temperature, said mold (3) comprising a bending surface (43, 52), said mold (3) comprising an electrical heating circuit (21) distributed in the mold (3) and a cooli...

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Bibliographic Details
Main Authors PROCUREUR PATRICK, MACHURA CHRISTOPHE, PELLETIER JOYCE
Format Patent
LanguageChinese
English
Published 18.03.2022
Subjects
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Summary:The invention relates to a full mold (3) for bending a glass sheet (1) by pressing, the glass sheet (1) being brought to a deformation temperature, said mold (3) comprising a bending surface (43, 52), said mold (3) comprising an electrical heating circuit (21) distributed in the mold (3) and a cooling circuit (20) distributed in the mold (3) through which a cooling fluid flows, the heating circuit being located between the bending surface (43, 52) and the cooling circuit (20). The mould (3) according to the invention can be easily adjusted to have a completely uniform curved surface (43, 52) temperature. The mould (3) is particularly suitable for bending glass having a thickness of at most 2.1 mm. 本发明涉及一种用于通过压制来弯曲玻璃片材(1)的全模具(3),玻璃片材(1)被带到变形温度,所述模具(3)包括弯曲表面(43、52),所述模具(3)包括分布在模具(3)中的电加热回路(21)和分布在模具(3)中、由冷却流体流经的冷却回路(20),加热回路位于弯曲表面(43、52)和冷却回路(20)之间。根据本发明的模具(3)可以容易地调节成具有完全均匀的弯曲表面(43、52)温度。所述模具(3)特别适于对厚度至多等于2.1 mm的玻璃进行弯曲。
Bibliography:Application Number: CN202180003860