SIP packaging structure and packaging method

• Main Authors: CHENG LANG, CHEN YONG, RAO XILIN, ZHANG YI, WANG TING, ZHENG XUEPING
• Format: Patent
• Language: Chinese; English
• Published: 18.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses an SIP packaging structure and method, and the structure comprises a substrate, the substrate is provided with a functional element and a passive device, the outer side of the functional element is sleeved with a shielding device which is not in contact with the functional element, the shielding device is welded with a bonding pad disposed on the substrate, and the bonding pad is disposed on the substrate. The substrate, the passive device, the functional element and the shielding device are packaged through a plastic package body. The shielding device and the functional element are separately mounted on the substrate, so that the functional element is located on the inner side of the shielding device to form regional shielding, the shielding device is more convenient to mount, and compared with a process of fixing a chip in a formed metalized groove to form regional shielding, the shielding device is low in investment cost and beneficial to implementation, and the cost is reduced. And