Positive polyimide resin composition

• Main Authors: WANG SHENGLIN, LI HOUMING, SU JIANGHUA
• Format: Patent
• Language: Chinese; English
• Published: 18.03.2022
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

The invention belongs to the technical field of material science, and discloses a positive polyimide resin composition, which is prepared from the following ingredients in parts by weight: 100 parts of polyimide resin, 1 to 50 parts of naphthoquinone diazide compounds, 10 to 200 parts of thermal crosslinking compounds, 0.01 to 5 parts of silane coupling agents, 10 to 15 parts of phenolic hydroxyl compounds, 0 to 5 parts of auxiliary agents and 50 to 2000 parts of solvents. When the positive polyimide resin composition prepared by the invention is used for developing, high film retention rate and high resolution can be maintained, and no residue on the edge of a developed pattern can be ensured. 本发明属于材料科学技术领域，本发明公开了一种正性聚酰亚胺树脂组合物，包括以下重量份的组分：聚酰亚胺树脂100份、萘醌二叠氮化合物1～50份、热交联性化合物10～200份、硅烷偶联剂0.01～5份、酚式羟基化合物10～15份、助剂0～5份、溶剂50～2000份。本发明所制备的正性聚酰亚胺树脂组合物，用于显影时既能保持高的留膜率及高的解析度，又能确保显影后的图案边缘无残留。