Blind-mating connector between circuit boards for 5G communication

• Main Authors: FENG LIANG, XIAO XIANGYU, LI MINGMING, YU FEI
• Format: Patent
• Language: Chinese; English
• Published: 15.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention relates to a circuit or communication element connecting device, in particular to an inter-circuit board blind-mating connector for 5G communication, which comprises an upper circuit board, a lower circuit board, a middle blind-mating assembly and a switching blind-mating assembly, the middle blind-mating assembly and the switching blind-mating assembly are arranged between the upper circuit board and the lower circuit board, and the middle blind-mating assembly comprises a middle circuit board and a middle contact pin; the switching blind-mating assembly comprises a switching circuit board and a switching pin. The upper circuit board is provided with an upper socket; the lower circuit board is provided with a lower socket; the upper end and the lower end of the middle contact pin are respectively matched and plugged with the upper socket and the adapter contact pin; and the lower end of the adapter pin is matched and plugged with the lower socket. By using the blind-mating connector, the large-