Welded product manufacturing device and welded product manufacturing method

• Main Authors: MARUYAMA MEGUMI, SUZUKI TAKAYUKI, OZAWA NAOTO, MATSUDA JUN, NAGAHAMA MASANOBU
• Format: Patent
• Language: Chinese; English
• Published: 11.03.2022
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A solder product manufacturing apparatus (1) is provided with: a stage (13) on which a substrate (W) on which solder is disposed is placed; a cover body (16) covering at least an upper portion of the substrate (W) placed on the stage (13) with a specific distance therebetween; a chamber (11) that accommodates the stage (13) and the lid (16); a heating unit (15) that heats the substrate (W) on the stage (13); and a reducing gas supply device (19) for supplying a reducing gas (F). The method for manufacturing a welded product uses a welded product manufacturing apparatus (1), a substrate (W) is placed on a stage (13), the substrate (W) placed on the stage (13) is covered with a lid (16), the substrate (W) is heated, and a reducing gas (F) is supplied into a chamber (11). 焊接制品制造装置(1)具备：载台(13)，载置有配置有焊料的基板(W)；盖体(16)，隔有特定距离地覆盖载置于载台(13)的基板(W)的至少上部；腔室(11)，收容载台(13)及盖体(16)；加热部(15)，加热载台(13)上的基板(W)；及还原气体供给装置(19)，供给还原气体(F)。焊接制品的制造方法为使用焊接制品制造装置(1)，将基板(W)载置于载台(13)，以盖体(16)覆盖载置于载台(13)的基板(W)，加热基板(W)，于腔室(11)内供给还原气体(F)。