Modularized interboard cooler and ship cooling system

• Main Authors: WU JUN, CHEN KAI, LI YONG, ZOU ZHENHAI, QIU ZHIQIANG, PANG JIE, GOU JINLAN, WANG RUIQI, XIAO QI, CHEN ZHAOXU, LIN YUANSHENG, WANG JUNRONG, LI BANGMING, KE HANBING, WEI ZHIGUO
• Format: Patent
• Language: Chinese; English
• Published: 11.03.2022
• Subjects: BLASTING; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; HEAT EXCHANGE IN GENERAL; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEATING; LIGHTING; MECHANICAL ENGINEERING; WEAPONS

The invention provides a modular interboard cooler and a ship cooling system. The modular interboard cooler comprises a shell, a tube bundle and a plurality of deflection baffles. The tube bundle is arranged in the shell; a shell pass runner is formed between the tube bundle and the shell; a water inlet is formed in the shell wall of one end, close to the tube bundle, of the shell; a water outlet is formed in the shell wall of the other end, close to the tube bundle, of the shell; the multiple deflection baffles are arranged in the shell; the multiple deflection baffles are connected with the pipe bundle and are sequentially arranged at intervals in the length direction of the modular interboard cooler. And according to the arrangement sequence of the multiple deflection baffles, the tail end of the previous deflection baffle obliquely extends to the head end of the next deflection baffle relative to the width direction of the modular interboard cooler, so that the shell pass flow channel is a snake-shaped fl