Micro-electro-mechanical system package and method of forming same

• Main Authors: ZHENG JUNWEN, XIE ZONGLIN, CAI SHANGYING, MAO WEIZHI, ZHANG GUISONG
• Format: Patent
• Language: Chinese; English
• Published: 11.03.2022
• Subjects: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

Various embodiments of the present disclosure are directed to a micro-electro-mechanical system package including a wire bonded damper. The housing structure is located on the support substrate, and the micro-electro-mechanical system structure is located between the support substrate and the housing structure. The MEMS structure includes an anchor, a spring, and a movable mass. A spring extends from the anchor to the movable block to suspend the movable block in the cavity between the support substrate and the housing structure and allow it to move. A wire bond damper is located on the movable mass or on a structure around the movable mass. For example, a wire bond damper may be located on a top surface of the movable mass. As another example, a wire bond damper may be located on the support substrate laterally between the anchor and the movable mass. In addition, the wire bonding damper includes a wire formed by wire bonding and configured to suppress an impact on the movable mass. The embodiment of the inv