SEMICONDUCTOR PACKAGE

• Main Authors: LEE YOUNG-MIN, PARK SANGON
• Format: Patent
• Language: Chinese; English
• Published: 08.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor package includes: a first structure having a first insulating layer disposed on one surface, and a first electrode pad and a first dummy pad penetrating the first insulating layer; a second structure having a second insulating layer disposed on the other surface, the second insulating layer bonding the other surface to the one surface and the first insulating layer, and a second electrode pad and a second dummy pad penetrating the second insulating layer, the second electrode pads are respectively bonded to the first electrode pads, and the second dummy pads are respectively bonded to the first dummy pads. In the semiconductor chip, a ratio of a surface area per unit area of the first dummy pad to the first insulating layer on the one surface and a ratio of a surface area per unit area of the second dummy pad to the second insulating layer on the other surface gradually decrease toward side surfaces of the first structure and the second structure. 一种半导体封装件包括：第一结构，其具有设置在一个表面上的第一绝缘层以及穿透第一绝缘层的第一电