Near-net forming method of ultrathin diamond/copper composite material

The invention provides a near-net forming method of an ultra-thin diamond/copper composite material and the ultra-thin diamond/copper composite material obtained through the method. The preparation method comprises the following steps: 1) powder loading: putting tungsten-plated diamond powder and co...

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Bibliographic Details
Main Authors HAN CUILIU, ZHANG JIUXING, WU ZHENWANG, YANG XINYU
Format Patent
LanguageChinese
English
Published 08.03.2022
Subjects
ALLOYS
CASTING
CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
METALLURGY
PERFORMING OPERATIONS
POWDER METALLURGY
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WORKING METALLIC POWDER
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Summary:The invention provides a near-net forming method of an ultra-thin diamond/copper composite material and the ultra-thin diamond/copper composite material obtained through the method. The preparation method comprises the following steps: 1) powder loading: putting tungsten-plated diamond powder and copper powder into an agate mortar, uniformly mixing by taking alcohol as a medium, loading into a graphite mold in a wet powder state, and adding a piece of copper foil or a layer of copper powder on each of the upper surface and the lower surface; 2) drying: performing vacuum drying on the mold obtained in the step 1 at the temperature of 80-100 DEG C; 3) sintering: putting the dried and assembled mold into a furnace chamber of a spark plasma sintering system, applying pressure, vacuumizing and electrifying for sintering; and (4) polishing treatment is conducted, specifically, the composite material sintered and formed in the step (3) is simply polished through abrasive paper, carbon paper and redundant copper on t
Bibliography:Application Number: CN202111373732