SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: JIAN YUTING, CHEN BAINIAN, LIN YUENONG, CAI ZONGYUE
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The embodiment of the invention relates to a semiconductor packaging device and a method for manufacturing the semiconductor packaging device. An optical device comprising a carrier comprising a light transmissive layer and a light shielding layer disposed on the light transmissive layer is described. The optical device further includes a light emitter disposed on the carrier and a light detector disposed on the carrier. The optical device further includes a light transmissive encapsulation encapsulating the light emitter and the light detector, and a light shielding wall disposed in the light transmissive encapsulation and in contact with the light transmissive encapsulation and the light shielding layer. 本申请实施例涉及半导体封装装置及制造半导体封装装置的方法。本发明描述一种包含载体的光学装置，所述载体包含光透射层及安置于所述光透射层上的光屏蔽层。所述光学装置进一步包含安置于所述载体上的光发射器及安置于所述载体上的光检测器。所述光学装置进一步包含囊封所述光发射器及所述光检测器的光透射封装体，及安置于所述光透射封装体中且与所述光透射封装体及所述光屏蔽层接触的光屏蔽壁。