Image acquisition method, image acquisition apparatus, and wafer inspection apparatus

• Main Author: WOO MYUNG-HUN
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2022
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention discloses an image acquisition method, an image acquisition apparatus and a wafer inspection apparatus. A line scan camera is disposed above a wafer transfer path to continuously acquire local images having a predetermined size by imaging a scan region including a portion of the transfer path, and store the local images in an image storage unit. A local image including a predetermined feature point in the local images is detected by an image analysis unit, and an image merging unit merges a predetermined number of local images including the detected local image to obtain a complete image of the wafer. The image inspection unit analyzes the complete image of the wafer to detect defects in the wafer. 本发明公开一种图像获取方法、图像获取装置和晶片检查装置。线扫描相机设置在晶片传送路径上方以通过对包括传送路径一部分的扫描区域进行成像来连续获取具有预定尺寸的局部图像，并将局部图像存储在图像存储单元中。通过图像分析单元检测局部图像中包括预定特征点的局部图像，图像合并单元将包括检测到局部图像在内的预定数量的局部图像合并以获取晶片的完整图像。图像检查单元分析晶片的完整图像以检测晶片中的缺陷。