Insulation board laying device for floor heating

• Main Author: MAO LIFENG
• Format: Patent
• Language: Chinese; English
• Published: 25.02.2022
• Subjects: BUILDING; FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS; FIXED CONSTRUCTIONS

The invention relates to an insulation board laying device for floor heating, and relates to the technical field of insulation board laying. The insulation board laying device for floor heating comprises a movable frame, the movable frame is provided with a ground leveling device, a floor mat laying device and a glue solution coating device, the ground leveling device comprises an impurity removal mechanism and a dust suction mechanism, the impurity removal mechanism is used for removing protruding impurities on the ground, the dust suction mechanism is used for sucking and removing sundries, the floor mat laying device comprises a mat conveying mechanism and a flattening mechanism, the mat conveying mechanism conveys a floor mat to the ground, the flattening mechanism compacts the floor mat on the ground, the glue solution coating device is used for coating the floor mat with glue, and a containing box used for stacking insulation boards is arranged at the top of the movable frame. The process of removing su