METHOD FOR PRODUCING PHOTO SEMICONDUCTOR DEVICE

The present invention comprises: a step for forming a semiconductor layer on the surface of an n-type InP substrate (10); an etching step for etching a portion of the semiconductor layer to form an active layer ridge (20); a cleaning step for feeding starting gas for crystal growth and etching gas w...

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Bibliographic Details
Main Author ERA ATSUSHI
Format Patent
LanguageChinese
English
Published 01.02.2022
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Summary:The present invention comprises: a step for forming a semiconductor layer on the surface of an n-type InP substrate (10); an etching step for etching a portion of the semiconductor layer to form an active layer ridge (20); a cleaning step for feeding starting gas for crystal growth and etching gas while removing the Si adhering to the surface of the etched semiconductor layer; and a crystal growth step for forming an embedded layer (40) on both sides of the active layer ridge (20) at a treatment temperature that is higher than the temperature of the cleaning step. Cleaning is performed while the ridge shape is maintained. 包括:在n型InP基板(10)的表面形成半导体层的工序;对所述半导体层的一部分进行蚀刻来形成活性层脊(20)的蚀刻工序;边供给结晶生长的原料气体和蚀刻气体,边去除附着于被蚀刻的半导体层的表面的Si的清洁工序;以及在比所述清洁工序中的温度高的处理温度下,在活性层脊(20)的两侧形成埋入层(40)的结晶生长工序,以保持脊形状的状态进行清洁。
Bibliography:Application Number: CN20198097657