Heat sink for electronic equipment

• Main Authors: WANG PING, WANG CHONGYANG, JU DALIANG, YANG ZHEYUE, YANG TAO
• Format: Patent
• Language: Chinese; English
• Published: 01.02.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention discloses a heat sink, which comprises a base and a plurality of fins protruding from one surface of the base, wherein the base and the fins are independently composed of one or more anisotropic heat conduction films, and the anisotropic thermally conductive films are electrically insulating and have low Dk and Df values. The invention further discloses a method for manufacturing the heat sink and a method for removing thermal energy of electronic equipment having at least one heat generating component. 本发明公开了散热器，该散热器包括基座和从所述基座的一个表面突出的多个鳍片，其中所述基座和所述鳍片独立地由一个或多个的各向异性导热膜组成。所述各向异性导热膜是电绝缘的，具有低Dk和Df值。本发明还公开了用于制造所述散热器的方法和用于移除具有至少一个发热组件的电子设备的热能的方法。