5 GROUP 5 METAL COMPOUND FOR THIN FILM DEPOSITION AND METHOD OF FORMING GROUP 5 METAL CONTAINING THIN FILM USING THE SAME

A group 5 metal compound according to an embodiment of the present disclosure is represented by any one of the following and : in a formula 1 and a formula 2, M is any one selected from group 5 metal elements, n is any one selected from an integer of 1 to 5,R1 is any one selected from a linear alkyl...

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Main Authors JI SUNG-JUN, BAIK SUN-YOUNG, LEE TAE-YOUNG
Format Patent
LanguageChinese
English
Published 18.01.2022
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Summary:A group 5 metal compound according to an embodiment of the present disclosure is represented by any one of the following and : in a formula 1 and a formula 2, M is any one selected from group 5 metal elements, n is any one selected from an integer of 1 to 5,R1 is any one selected from a linear alkyl group having 3 to 6 carbon atoms and a branched alkyl group having 3 to 6 carbon atoms, and R2 and R3 are each independently any one selected from hydrogen, a linear alkyl group having 1 to 4 carbon atoms, and a branched alkyl group having 1 to 4 carbon atoms. 根据本公开的实施方案的第5族金属化合物由以下<化学式1>和<化学式2>中的任一个表示:在<化学式1>和<化学式2>中,M是选自第5族金属元素中的任意一种,n是选自1至5的整数中的任意一个,R1是选自具有3至6个碳原子的直链烷基基团和具有3至6个碳原子的支链烷基基团中的任意一种,并且R2和R3各自独立地为选自氢、具有1至4个碳原子的直链烷基基团和具有1至4个碳原子的支链烷基基团中的任意一种。
Bibliography:Application Number: CN202110693956