HIGH TEMPERATURE SUPERCONDUCTING CURRENT LEAD ASSEMBLY FOR CRYOGENIC APPARATUS

A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end...

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Bibliographic Details
Main Authors JIANG LONGZHI, FELTHAM STUART PAUL, YE LIYANG, STAUTNER ERNST WOLFGANG, LING JIAYIN, MORAN THOMAS EDWARD
Format Patent
LanguageChinese
English
Published 11.01.2022
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Summary:A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end, the plurality of channels forming a plurality of thermal surfaces within the heat exchanger, the heat exchanger having a transverse cross section. The method further includes modifying the 3D model by at least one of reducing an area of the cross section and increasing the plurality of thermal surfaces. The method also includes additively manufacturing the heat exchanger using an electrically-conductive and thermally-conductive material according to the modified 3D model. Further, the method includes providing a high temperature superconductor (HTS) assembly that includes an HTS strip, and connecting the HTS assembly to the heat exchanger at the second end of the heat exchanger. 本发明提供了一种制造低温系统的引线组件的方法。该方法包括开发热交换器
Bibliography:Application Number: CN202110682639