PHOTOCURABLE COMPOSITIONS FOR STEREOLITHOGRAPHY, STEREOLITHOGRAPHY METHODS USING THE COMPOSITIONS, POLYMER COMPONENTS FORMED BY THE STEREOLITHOGRAPHY METHODS, AND A DEVICE INCLUDING THE POLYMER COMPONENTS
A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
07.01.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22DEG C, determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23DEG C.
用于立体光刻三维打印的可光固化组合物,其中所述可光固化组合物包含:光反应性低聚物组分,所述光反应性低聚物组分包含含有光反应性端基的疏水性低聚物;光反应性单体组分,所述光反应性单体组分包含具有光反应性端基的光反应性单体;以及光引发组合物,所述光引发组合物包含光引发剂;所述可光固化组合物的使用Brookfield粘度计确定的在22℃下的粘度为250厘泊至10,000厘泊;以及经光固化的组合物的各自在23℃下在10吉赫下通过分离式介电谐振器测试确定的介电损耗小于0.010,优选地小于0.00 |
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Bibliography: | Application Number: CN202080039856 |