Heat dissipation structure for computer for edge computing

The invention belongs to the technical field of heat dissipation, and relates to a heat dissipation structure for a computer for edge computing, which comprises a mounting plate fixedly connected with the inner wall of a mainframe box of the computer; a heat dissipation assembly which is arranged on...

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Bibliographic Details
Main Authors NIE HUILAN, XU XU, QIAO XIAOYAN, SUN ZUYI, LI XILIANG
Format Patent
LanguageChinese
English
Published 04.01.2022
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:The invention belongs to the technical field of heat dissipation, and relates to a heat dissipation structure for a computer for edge computing, which comprises a mounting plate fixedly connected with the inner wall of a mainframe box of the computer; a heat dissipation assembly which is arranged on the mounting plate and comprises an exhaust fan which is positioned above the mounting plate and is fixedly connected with the inner wall of a mainframe box of the computer; a cold box, wherein an inlet of the cold box communicates with an outlet of the exhaust fan; an air compressor arranged on the mounting plate, wherein an inlet of the air compressor communicates with an outlet of the cold box; a spray head which is arranged on the mounting plate, the spray head communicates with one end of the Laval pipe, wherein the other end of the Laval pipe communicates with an outlet of the air compressor, and the controller is electrically connected with the exhaust fan, the cold box and the air compressor; and a power s
Bibliography:Application Number: CN202111351291