POLISHING PLATENS AND POLISHING PLATEN MANUFACTURING METHODS

• Main Authors: ZUNIGA STEVEN M, KIM BUM JICK, GURUSAMY JAY, LOI DANIELLE
• Format: Patent
• Language: Chinese; English
• Published: 31.12.2021
• Subjects: CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; HAND CUTTING TOOLS; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEVERING; TRANSPORTING

Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing includes positioning a polishing platen on a support of a manufacturing system. The manufacturing system includes the support and a cutting tool facing there towards. Here, the polishing platen includes a cylindrical metal body having a polymer layer disposed on a surface thereof and the polymer layer has a thickness of about 100 [mu]m or more. The method further includes removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface. Beneficially, the method may be used to form a pad-mounting surface having a desired flatness or shape, such as a concave or convex shape. 本公开的实施例总体上涉及制造用于化学机械抛光(CMP)系统的抛光台板的方法以及由其形成的抛光台板。一种制造抛光台板的方法包括将抛光台板定位在制造系统的支撑件上。所述制造系统包括支撑件和面向支撑件的切割工具。此处，抛光台板包括圆柱形金属体，所述圆柱形金属体的表面上设置有聚合物层，并且所述聚合物层的厚度为约100μm或以上。