Reinforcement and heat dissipation structure of large-mass and large-power-consumption PGA device and processing method

• Main Authors: JIA SEN, LI YONG, QUAN YONGTAO, WANG QIANG, WANG BO, LU HAIQUAN, MIAO FENGCHEN, LIU SHURONG
• Format: Patent
• Language: Chinese; English
• Published: 31.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The invention discloses a reinforcement and heat dissipation structure of a large-mass and large-power-consumption PGA device and a processing method. The reinforcement and heat dissipation structure comprises a PGA device arranged on a printed board, the top of the PGA device is provided with an n-shaped metal support, and a Bags film is arranged between the n-shaped metal support and the PGA device; a metal structure sheet is arranged between the PGA device and the printed board, and the metal structure sheet is in contact with the bottom of the PGA device; the printed board is provided with a metal frame, and the n-shaped metal support and the metal structure sheet are in contact with the metal frame. The four corners of the PGA device are coated with epoxy glue. According to the reinforcement and heat dissipation structure and the processing method, the large-mass and large-power-consumption PGA device can be reliably reinforced, the heat dissipation problem of the PGA device can be effectively solved, an