Epoxy modified chlorinated polypropylene adhesive

• Main Authors: PAN LONGQIANG, XU JING, LUO RUIYI, GU BAOLIANG
• Format: Patent
• Language: Chinese; English
• Published: 31.12.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention discloses an epoxy modified chlorinated polypropylene adhesive, and belongs to the technical field of chlorinated polypropylene modification and adhesives. The epoxy modified chlorinated polypropylene adhesive disclosed by the invention is prepared from the following components in parts by weight: 60 to 85 parts of chlorinated polypropylene, 20 to 40 parts of epoxy resin, 10 to 15 parts of polysulfone resin, 0.15 to 0.22 part of initiator, 0.4 to 1.6 parts of silane coupling agent and 140 to 200 parts of organic solvent. The epoxy modified chlorinated polypropylene adhesive is obtained by blending and modifying chlorinated polypropylene, hydrogenated bisphenol A epoxy resin, polyether epoxy resin and polysulfone resin in proportion, can be used for adhesion among most metals, ceramics and glass, and can also be used for room-temperature adhesion between plastics such as polyolefin and other materials. 本发明公开了一种环氧改性的氯化聚丙烯粘合剂，属于氯化聚丙烯改性及粘合剂技术领域。本发明环氧改性的氯化聚丙烯粘合剂按重量份数计包括以下组分：氯化聚丙烯60-85份、环氧树脂20-40份、聚砜树