SEMICONDUCTOR DEVICE

• Main Authors: SAWAGAWA ASAO, TANI MASAKAZU, SHIOTA HIROKI, MIYAJI HITOTAKA, NAKADA KATSUSHI
• Format: Patent
• Language: Chinese; English
• Published: 21.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The semiconductor device includes: a semiconductor module including a plate-shaped semiconductor element, a conductor electrically connected to one surface of the semiconductor element, a heat dissipation plate of which one surface is thermally and electrically connected to another surface of the semiconductor element, a resin member sealing the semiconductor element, the conductor, and the heat dissipation plate, and an insulation heat dissipation member thermally connected to another surface of the heat dissipation plate exposed from the resin member; a heatsink thermally connected to the insulation heat dissipation member; and an electric field inhibiting plate including a plate-shaped covering part covering the one surface of the semiconductor element and opposed thereto so as to be separated therefrom, the covering part being sealed by the resin member, and a connection part extending from the covering part to the heatsink and thermally and electrically connected to the heatsink. 本发明的半导体装置包括：半导体模块，其具有板状的