Primer-attached copper foil and copper foil laminate

• Main Authors: SEO HYEON-JIN, LEE JUN-HYUK, CHO KYEONG-WOON, LEE HYE-SUN, HAN GA-YOUNG, KIM JAE-MEE
• Format: Patent
• Language: Chinese; English
• Published: 17.12.2021
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; TRANSPORTING; USE OF MATERIALS THEREFOR; WOODSTAINS

The present invention relates to a primer-attached copper foil for forming a printed circuit board and a copper foil laminate, which are capable of realizing a high-density fine circuit pattern and ensuring good adhesion and low dielectric constant characteristics. The primer-attached copper foil in...