Primer-attached copper foil and copper foil laminate

• Main Authors: SEO HYEON-JIN, LEE JUN-HYUK, CHO KYEONG-WOON, LEE HYE-SUN, HAN GA-YOUNG, KIM JAE-MEE
• Format: Patent
• Language: Chinese; English
• Published: 17.12.2021
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; TRANSPORTING; USE OF MATERIALS THEREFOR; WOODSTAINS

The present invention relates to a primer-attached copper foil for forming a printed circuit board and a copper foil laminate, which are capable of realizing a high-density fine circuit pattern and ensuring good adhesion and low dielectric constant characteristics. The primer-attached copper foil includes a copper foil layer and a primer layer disposed on one or both surfaces of the copper foil layer, and the primer layer is formed from a primer resin composition containing (a) at least one compound selected from the group consisting of 42.5-80 parts by weight of a thermoplastic polyimide resin and 29.04-90 parts by weight of a rubber resin, and (b) 30-98 parts by weight of an epoxy resin. The epoxy resin includes a first epoxy resin having an epoxy equivalent weight of 400-1000 g/eq and a second epoxy resin having an epoxy equivalent weight of 100-300 g/eq, and the average roughness Rz of one or both surfaces of the copper foil layer on which the primer layer is disposed is 1.5 [mu] m or less. 本发明涉及能够实现高密度微细