VCSEL chip cylindrical surface etching method based on self-alignment technology, and application thereof

• Main Authors: JIANG AITING, QIAN XU, WANG GUANGHUI, LYU CHAOCHEN, WANG QING, ZHAO FENGCHUN
• Format: Patent
• Language: Chinese; English
• Published: 14.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRICITY

The invention discloses a VCSEL chip cylindrical surface etching method based on a self-alignment technology, and application thereof. The VCSEL chip cylindrical surface etching method comprises the steps that an N contact layer, an NDBR layer, an active layer, an oxide layer, a PDBR layer and a P contact layer are formed on a substrate layer by layer, and a metal circular ring is formed on the P contact layer; and an area outside the outer edge of the metal circular ring is etched to make a cylindrical surface etched below the metal circular ring and the oxide layer exposed. The metal circular ring is used as a hard mask layer in etching, a central mask layer is used for shielding the hollow position of the metal circular ring, and the edge of the central mask layer is located between the outer edge and the inner edge of the metal circular ring. The method is simple in process and convenient to implement, the self-alignment technology is adopted, the center of the mask layer does not need to directly face th