Semiconductor device

• Main Authors: OOKA YUTAKA, KOMAI NAOKI, INOUE TAKASHI, OSADA MASAYA, SASAKI NAOTO, IWAMOTO HAYATO, OGAWA NAOKI
• Format: Patent
• Language: Chinese; English
• Published: 14.12.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a semiconductor device. The semiconductor device may include: a first semiconductor substrate in which a pixel region is formed, in which a pixel portion that performs photoelectric conversion is two-dimensionally arranged, and a second semiconductor substrate in which a pixel portion that performs photoelectric conversion is two-dimensionally arranged, a logic circuit for processing a pixel signal output from the pixel portion is formed in the second semiconductor substrate, and the first semiconductor substrate and the second semiconductor substrate are stacked. A protective substrate for protecting the on-chip lens is disposed on the on-chip lens in the pixel region of the first semiconductor substrate, and a sealing resin is disposed between the protective substrate and the on-chip lens. 本发明涉及半导体器件。该半导体器件可包括：第一半导体基板和第二半导体基板，在所述第一半导体基板中形成有像素区域，在所述像素区域内二维布置有进行光电转换的像素部，在所述第二半导体基板中形成有用于处理从所述像素部输出的像素信号的逻辑电路，所述第一半导体基板与所述第二半导体基板被层叠，其中，在所述第一半导体基板的所述像素区域内的片上透镜上布置有用于保护所述片上透镜的保护基板，在所述保护基板与所述