Device for small saw of machining center to adapt to plate thickness
The invention provides a device for a small saw of a machining center to adapt to the plate thickness. According to the device, a fixed relative distance can be kept between a saw blade of the small saw and a pressing roller, the distance is also the depth size of a lineation line of the small saw,...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
10.12.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides a device for a small saw of a machining center to adapt to the plate thickness. According to the device, a fixed relative distance can be kept between a saw blade of the small saw and a pressing roller, the distance is also the depth size of a lineation line of the small saw, plates of different thicknesses make direct contact with a rolling wheel, the plates can directly lift the small saw to the needed height, and therefore the purpose of automatically adapting to different plates is achieved. The device comprises an air cylinder component, a sliding seat component, a sliding plate component, a small saw component and a self-adaption component, wherein the sliding plate component is installed on the sliding seat component; the top of the sliding plate component is connected with the air cylinder component; the bottom of the sliding plate component is connected with the small saw component; the bottom of the small saw component is connected with the self-adaption component; and the sel |
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Bibliography: | Application Number: CN202111120449 |