THERMAL BREAK FOR HIGH-FREQUENCY ANTENNAE

Embodiments disclosed herein include a high-frequency emission module. In an embodiment, the high-frequency emission module comprises a solid state high-frequency power source, an applicator for propagating high-frequency electromagnetic radiation from the power source, and a thermal break coupled b...

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Bibliographic Details
Main Authors NGUYEN HANH, KRAUS PHILIP, CHUA THAI
Format Patent
LanguageChinese
English
Published 26.11.2021
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Summary:Embodiments disclosed herein include a high-frequency emission module. In an embodiment, the high-frequency emission module comprises a solid state high-frequency power source, an applicator for propagating high-frequency electromagnetic radiation from the power source, and a thermal break coupled between the power source and the applicator. In an embodiment, the thermal break comprises a substrate, a trace on the substrate, and a ground plane. 本文所公开的实施方式包括高频发射模块。在一个实施方式中,高频发射模块包含固态高频功率源、用于从功率源传播高频电磁辐射的施加器、及耦合于功率源及施加器之间的断热器。在一个实施方式中,断热器包含基板、在基板上的迹线及接地平面。
Bibliography:Application Number: CN20208029818